
T-Wave´Â ´ëÇѹα¹ÀÇ ¹«¼±Åë½Å ±â±âÀÇ °³¹ß¿¡ ÇÊ¿äÇÑ Analog/RF circuit µðÀÚÀÎ ¹× 3D ½Ã¹Ä·¹ÀÌ¼Ç ¼ÒÇÁÆ®¿þ¾îÀÇ °ø±ÞÀ» À§ÇÏ¿© ´Ù¾çÇÑ ¼Ö·ç¼ÇÀ» Line-up Çϱâ À§ÇØ Èû¾²°í ÀÖ½À´Ï´Ù.
2COMU»ç´Â FDTD method±â¹ÝÀÇ Full 3D º´·Ä ¿¬»ê ó¸® ÀüÀÚ±âÀå ÇØ¼® ¼ÒÇÁÆ®¿þ¾î ÅøÀÎ GEMS¸¦ Ãâ½Ã ÇÏ¸é¼ ¼¼°èÀÇ ÁÖ¸ñÀ» ¹Þ°í Àִ ȸ»ç·Î 4000°³ ÀÌ»óÀÇ CPU¸¦ º´·Ä·Î ¹Àº ȯ°æ¿¡ GEMS¸¦ ÀνºÅç ÇÏ¿© ¸Å¿ì º¹ÀâÇÏ°í °Å´ëÇÑ ¹®Á¦¸¦ ¸Å¿ì ºü¸¥ ½Ã°£³»¿¡ ÇØ¼®À» ¿Ï·áÇÑ ¼¼°è±â·Ï(World record)À» º¸À¯ Çϰí ÀÖÀ¸¸ç, ¶Ù¾î³ º´·Äó¸® ±â¼úÀº IBM»çÀÇ ½´ÆÛ ÄÄÇ»ÅÍ ¼º´É Å×½ºÆ®¸¦ À§Çؼµµ ¾²ÀÎ ¹Ù ÀÖÀ¸¸ç FDTD ÀÌ·ÐÀÇ ±ÇÀ§ÀÚÀ̽ŠAlan Tafflov ±³¼ö¿Í CEM (Computational Electromagnetic)ÀÇ ±ÇÀ§ÀÚÀ̽ŠRaj Mittra ±³¼ö¸¦ Æ÷ÇÔ ´Ù¾çÇÏ°íµµ ½Å¸ÁÀÖ´Â ¸¹Àº supporterµéÀ» º¸À¯Çϰí ÀÖ½À´Ï´Ù. »ç¿ëÀÚ´Â ÄÄÇ»ÅÍÀÇ ¸®¼Ò½º(¼º´É/¸Þ¸ð¸®) ¹®Á¦·Î ÇØ°áÇÏÁö ¸øÇß´ø ³ÇØÇÏ°í º¹ÀâÇÑ ±¸Á¶µéÀÇ ÇØ¼®À» GEMS¸¦ ÅëÇØ ÇØ°áÇÒ ¼ö ÀÖ°Ô µÇ¾úÀ¸¸ç, 2008³âºÎÅÍ Æ¼¿þÀ̺갡 ¸ðµç ¸¶ÄÉÆÃ ÆÇ¸Å ±â¼úÁö¿ø ¹× ±³À°À» Àü´ãÇϰí ÀÖ½À´Ï´Ù.
Artwork Conversion Software»ç´Â Mentorgraphics, Cadance, Agilent, CST, Ansysµî¿¡ OEM °ø±Þ ÀÌ·ÂÀ» °®°í ÀÖ´Â ´ëÇ¥ÀûÀÎ µ¥ÀÌÅÍ º¯È¯ ¼ÒÇÁÆ®¿þ¾î °³¹ß ȸ»çÀÔ´Ï´Ù. ±×Áß ´ëÇ¥ÀûÀÎ ¼Ö·ç¼ÇÀÎ Netex-G´Â PCB µðÀÚÀÎ Åø¿¡¼ °øÅëÀûÀ¸·Î »ý¼º µÇ´Â Gerber ÇüÅÂÀÇ Æ÷¸ËÀ» EDA ȯ°æ(½Ã¹Ä·¹ÀÌ¼Ç È¯°æ)¿¡¼ ¿ä±¸ ÇÏ´Â DXF, ANF, GDSll, ASCll, ACIS, DXF, EGS, 3DI ÇüÅÂÀÇ Æ÷¸ËÀ¸·Î º¯È¯ ÇÏ¿© ÁÖ´Â ±â´ÉÀ» Á¦°ø ÇÏ¸ç Æ¼¿þÀ̺갡 ¸ðµç ¸¶ÄÉÆÃ ÆÇ¸Å ±â¼úÁö¿ø ¹× ±³À°À» Àü´ã Çϰí ÀÖ½À´Ï´Ù.
MEM Research»ç´Â Full 3D /2.5D ȯ°æÀÇ MoM method ±â¹Ý ÀüÀÚ±âÀå ÇØ¼® ÅøÀÎ EM3DS¸¦ °ø±Þ Çϰí ÀÖ½À´Ï´Ù. ƯÈ÷ acoustic material(Piezo-electric¿Ü)¸¦ °í·ÁÇÑ EM simulationÀÌ °¡´ÉÇÑ À¯ÀÏÇÑ ¼Ö·ç¼ÇÀ¸·Î¼ ¸¹Àº »ç¶ûÀ» ¹Þ°í ÀÖ´Â ¼ÒÇÁÆ®¿þ¾î Á¦Ç°ÀÔ´Ï´Ù. »ç¿ëÀÚ¿Í Ä£¼÷ÇÑ ÀÎÅÍÆäÀ̽º¸¦ Á¦°ø Çϸ鼵µ Àú·ÅÇÑ ºñ¿ëÀ¸·Î ±¸Á¶ ÇØ¼® ¹®Á¦¸¦ ÇØ°á ÇϽǼö ÀÖ½À´Ï´Ù. Ƽ¿þÀ̺갡 ¸ðµç ¸¶ÄÉÆÃ ÆÇ¸Å ±â¼úÁö¿ø ¹× ±³À°À» Àü´ã Çϰí ÀÖ½À´Ï´Ù.
Nuherz»ç´Â ±ºÁö¿¬(Group Delay)¸¦ °í·ÁÇÑ ÇÊÅÍ ÇÕ¼ºÀ» ÇÒ ¼ö ÀÖ´Â Filter SolutionÀ» °ø±ÞÇϰí ÀÖ´Â filter design synthesis Á¦Ç°±º Áß¿¡ °¡Àå °·ÂÇÏ°í ½Å·Ú¼º ÀÖ´Â Á¦Ç°À¸·Î Á¤ÆòÀÌ ³ª ÀÖÀ¸¸ç ƯÈ÷ AWR»çÀÇ Microwave Office, Sonnet EM simulator ¹× ADSµî°úÀÇ ¿¬°è¸¦ ÅëÇØ ÇÊÅÍÀÇ ±¸Á¶ ¼³°è±îÁö ´Ü¹ø¿¡ ¿Ï·áÇÒ ¼ö ÀÖ´Â ¼Ö·ç¼ÇÀ» °âºñÇϰí ÀÖ½À´Ï´Ù. LC filter, Microstrip filter, Active filter, Switched Cap filter ¹× Digital filter±îÁö ¸ðµç Á¾·ùÀÇ filter ¼³°è°¡ °¡´ÉÇÏ¸ç »ç¿ëÀÚ´Â ÇÊÅÍ¿¡ ´ëÇÑ °£´ÜÇÑ ÀÌÇØ¸¸ ÀÖ´Ù¸é ´©±¸³ª Â÷¼ö(order)¿¡ °ü°è¾øÀÌ ´Ù¾çÇÏ°íµµ ³À̵µ ÀÖ´Â ÇÊÅ͵éÀ» µðÀÚÀÎ ÇÒ ¼ö ÀÖ½À´Ï´Ù. Ƽ¿þÀ̺갡 ¸ðµç ¸¶ÄÉÆÃ ÆÇ¸Å ±â¼úÁö¿ø ¹× ±³À°À» Àü´ã Çϰí ÀÖ½À´Ï´Ù.
MIG»ç´Â 10¿© ³â°£ ÀÌ¹Ì À¯·´ÀÇ ¿ìÁÖÇ×°ø ¹× military ½ÃÀå¿¡¼ ±× ¸í¼ºÀ» ³ôÀ̰í ÀÖ´Â ¾÷ü·Î Waveguide, Coaxial, Horn, Combline ¶Ç´Â Interdigital component/filterµîÀÇ ¼³°è/ÇÕ¼º ÈÄ Optimization/tuningÀ» °¡´ÉÄÉ ÇÏ´Â ¾÷°è¿¡ À¯ÀÏÇÑ Hybrid EM ¼ÒÇÁÆ®¿þ¾î toolÀÎ WASP-NET Á¦Ç°À» °³¹ßÇÏ¿© °ø±ÞÇÏ´Â ¾÷ü ÀÔ´Ï´Ù.
CDS (CAD Design Software)»ç´Â Autodesk»çÀÇ Authorized Developer·Î¼ AutoCAD ȯ°æ¿¡¼ Flex PCB/RF/LTCC/Hybrid/MCM/Leadframe/IC packagingµî °¢Á¾ ÀÀ¿ëºÐ¾ßÀÇ ¼³°è¸¦ Àü¹®ÀûÀ¸·Î ¼öÇàÇÒ ¼ö ÀÖµµ·Ï ºÎ°¡ÀûÀÎ µµ¿òÀ» Á¦°øÇÏ´Â ¼Ö·ç¼ÇÀÔ´Ï´Ù. Ƽ¿þÀ̺갡 ¸ðµç ¸¶ÄÉÆÃ ÆÇ¸Å ±â¼úÁö¿ø ¹× ±³À°À» Àü´ã Çϰí ÀÖ½À´Ï´Ù.
IntelliSense»ç´Â MEMSÀÇ total solutionÀ» Á¦°øÇÏ´Â MEMS Àü¹® ¾÷ü·Î¼ ¼¼°è 35°³ ÀÌ»óÀÇ ±¹°¡¿¡ ÀÚ»çÀÇ IntelliSuite Á¦Ç°À» °ø±ÞÇϰí ÀÖ½À´Ï´Ù. Ƽ¿þÀ̺ê´Â IntelliSense»çÀÇ ±¹³» µ¶Á¡ ´ë¸®Á¡À¸·Î¼ ÇâÈÄ ¸ðµç ºÐ¾ß¿¡ Àû¿ëµÉ MEMS ¼Ö·ç¼ÇÀ» °ø±ÞÇϴµ¥ Áú·ÂÀ» ´ÙÇÒ °ÍÀÔ´Ï´Ù. ¸ðµç ¸¶ÄÉÆÃ ÆÇ¸Å ¹× ±â¼úÁö¿ø ±×¸®°í ±³À°À» Àü´ãÇϰí ÀÖ½À´Ï´Ù.
T-Wave´Â ¾ÕÀ¸·Îµµ ¾ÈÅ׳ª(½Ã½ºÅÛ) Åë½Å¿ë ½Ã½ºÅÛ PCB ¹× ÆÐŰÁöµîÀÇ ÇØ¼®¿¡ ÇÊ¿äÇÑ ½Ã¹Ä·¹ÀÌ¼Ç ¼ÒÇÁÆ®¿þ¾î °³¹ß ¹× °ø±Þ¿¡ ÃÖ¼±À» ´ÙÇÒ °ÍÀ̸ç ÀÌ¿¡ µû¸£´Â ±â¼úÁö¿ø ¹× ±³À°ÀÇ Á¦°ø¿¡µµ ¸¸ÀüÀ» ±âÇØ ³ª¾Æ°¥ °ÍÀÔ´Ï´Ù. |